With the ability to perform pre or post reflow inspection, handle large format samples, and optional dual-lane configuration, the VT-S530 handles any production environment. Built-in 3D and 2D inspection technologies measure ensure every solder joint while adhering to industrial IPC Standards. Additionally, Omron’s completely offline programming and review software guarantee the least amount of process interruption.
Launch Video
Launch Video
Overview
- Omron, patented, Enchanced-3D solder joint profiling
- AI-assisted, image processing
- MDMC Color-Highlight illumination™ (multi-direction / multi-channel)
- Quad, digital-MPS 3D hardware (multi-phase shift) 4-camera, angle-view inspection capabilities
- Quantitative and comprehensive, real-3D measurement based inspection
- IPC-compliant inspection approach
- User-friendly, reliable operation and performance
- Fast and easy, full offline programming approach
- Intuitive, visual-based inspection review process
- Integrated quality analysis software (Omron Q-up Navi) for true process improvement
- Backed by Omron’s world class training, service and support